We blend dendritic copper, graphene and micro diamond into epoxy to produce a thermally conductive adhesive. You can purchase the premixed epoxy at our website
https://www.techingredients.com/shopThermal Epoxy (low viscosity infusion resin) formula using 3:1 epoxy
8:6:2:1
8g of epoxy
6g of dendritic copper
2g of graphene
1g of diamond
Ingredient sources:
Copper powder: Novamet Specialty Products, dendritic copper powder Lebanon, TN USA
2,000 grit diamond powder: TechDiamondTools.com, eBay store
Graphene: 5-10 layer powder from Ledmarket1997, eBay store
Find us on Patreon -
https://www.patreon.com/techingredientsand our website
https://www.techingredients.com/